Haas SWA 30G 30 plate wafer line

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Haas

 SWA 30G 2005 290 x 468 mm

Further details


Wafer Baking machine SWA 30G for production of flat wafer sheets, gas heated.

Hard–chrome plating CR-SWA:
- Baking plate format : 290 x 468 mm
Engravings : Lower plate : 2,0x0,5 mm, oblique (450)
Upper plate : 2,0x0,5 mm, straight (900)
- Batter depositor system
- Heating system for baking chamber
- Automatic wafer sheet take-off device
- Wafer sheet size (considering wafer shrinkage): 288 x 465 mm

Sheet thickness : 2,5mm +/- 0,1 mm
Sheet’s weight : 53-54g (depending on recipe and raw material)

Performance of baking machine SWA 30 G is 15 sheets per minute

Max gas consumption : 615 MJ/hod
(with gas heating value 8800 kcal/m3 is then max consumption
16.7 m3/hod)

Electric input : 4kW

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Tel: +44 (0) 1427 611969   E-Mail: sales@amp-rose.com

A.M.P-Rose
Heapham Road North, Gainsborough, Lincolnshire, DN21 1QU England.
Telephone:+ 44 (0) 1427 611969  Fax:+44 (0) 1427 616854  E-Mail: info@amp-rose.com